? semiconductor components industries, llc, 2015 april, 2017 ? rev. 3 1 publication order number: NCP51145/d NCP51145 ddr 1.8 amp source / sink v tt termination regulator the NCP51145 is a linear regulator designed to supply a regulated v tt termination voltage for ddr?ii, ddr?iii, lpddr?iii and ddr?iv memory applications. the regulator is capable of actively sourcing and sinking 1.8 a peak currents while regulating an output voltage to within 20 mv. the output termination voltage is regulated to track v ddq / 2 by two external voltage divider resistors connected to the pv cc , gnd, and v ref pins. the NCP51145 incorporates a high?speed differential amplifier to provide ultra?fast response to line and load transients. other features include source/sink current limiting, soft?start and on?chip thermal shutdown protection. features ? for ddr v tt applications, source/sink currents: ? supports ddr?ii to 1.8 a, ddr?iii to 1.5 a ? supports lpddr?iii and ddr?iv to 1.2 a ? stable using ceramic?only (very low esr) capacitors ? integrated power mosfets ? high accuracy v tt output at full?load ? fast transient response ? built?in soft?start ? shutdown for standby or suspend mode ? integrated thermal and current?limit protection ? v tt remote sense available in the dfn8 2x2mm package ? these devices are pb?free and are rohs compliant typical applications ? ddr?ii / dr?iii / ddr?iv sdram t ermination voltage ? motherboard, notebook, and vga card memory termination ? set top box, digital tv, printers ? low power ddr?3lp marking diagrams www. onsemi.com soic?8 ep d suffix case 751bu device package shipping ? ordering information soic?8 (pb?free) 2500 / tape & reel NCP51145pdr2g nc v tt 18 nc vref v cc gnd nc pvcc pin connections 1 8 1 8 51145 ayww 51145 = specific device code xx = specific device code m = date code a = assembly location y = year ww = work week = pb?free package soic?8 ep ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. dfn8 mn suffix case 506aa 1 xxm 1 (note: microdot may be in either location) dfn?8 (pb?free) 3000 / tape & reel NCP51145mntag dfn8 2x2, 0.5p vref gnd 18 nc nc v tts v tt pvcc (top views) v cc
NCP51145 www. onsemi.com 2 c1 = 1 to 100 nf ceramic c4 = 10 f ceramic c2 = 10 f ceramic r3 = optional v tt discharge resistor c3 = 1 f n?ch mosfet = optional enable / disable figure 1. application diagram NCP51145 so8?ep package pv cc gnd v ref v cc v tt c2 1 2 3 6 4 c4 c3 5 v r3 c1 r1 100k r2 100k enable pv cc = 1.0 to 5.5 v* v tt = 0.6 to 2.5 v* r4 2.2 *for ddr2: pv cc = 1.8 v, v tt = 0.9 v ddr3: pv cc = 1.5 v, v tt = 0.75 v ddr4: pv cc = 1.2 v, v tt = 0.60 v ep pin function description pin no. so8?ep pin no. dfn8 pin name description 1 1 pv cc input voltage which supplies current to the output pin. c in ? c out 2 4 gnd common ground 3 5 v ref buffered reference voltage input equal to ? of v ddq and active low shutdown pin. an external resistor divider dividing down the pv cc voltage creates the regulated output voltage. pulling the pin to ground (0.15 v maximum) turns the device off. 4 2 v tt regulator output voltage capable of sourcing and sinking current while regulating the output rail. c out = 10 f ceramic, or greater 5, 7, 8 3, 7 nc true no connect 6 8 v cc the v cc pin is a 5 v input pin that provides internal bias to the controller. pv cc should always be kept lower or equal to v cc . ? 6 v tts v tt sense ep ep epad pad for thermal connection. the exposed pad must be connected to the ground plane using multiple vias for maximum power dissipation performance.
NCP51145 www. onsemi.com 3 absolute maximum ratings rating symbol value unit input supply voltage range (v cc pv cc ) (note 1) pv cc , v cc ?0.3 to 6 v output voltage range v tt ?0.3 to 6 v reference input range v ref ?0.3 to 6 v maximum junction temperature t j(max) 150 c storage temperature range tstg ?65 to 150 c esd capability, human body model (note 2) esdhbm 2 kv esd capability, machine model (note 2) esdmm 200 v lead temperature soldering reflow (smd styles only), pb?free versions (note 3) t sld 260 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. refer to electrical characteristics and application information for safe operating area. 2. this device series incorporates esd protection and is tested by the following methods: esd human body model tested per aec?q100?002 (eia/jesd22?a114) esd machine model tested per aec?q100?003 (eia/jesd22?a115) latchup current maximum rating: 150 ma per jedec standard: jesd78 3. for information, please refer to our soldering and mounting techniques reference manual, solderrm/d thermal characteristics rating symbol value unit thermal characteristics, so8?ep (note 4) thermal resistance, junction?to?air (note 5) thermal reference, junction?to?lead2 (note 5) r ja r jl 82 tbd c/w 4. refer to electrical characteristis and application information for safe operating area. 5. values based on copper area of 645 mm 2 (or 1 in 2 ) of 1 oz copper thickness and fr4 pcb substrate. operating ranges (note 6) rating symbol min max unit input voltage pv cc 1.0 5.5 v bias supply voltage v cc 4.75 5.25 v ambient temperature t a ?40 85 c functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability. 6. refer to electrical characteristics and application information for safe operating area.
NCP51145 www. onsemi.com 4 electrical characteristics pv cc = 1.8 v / 1.5 v; v cc = 5 v; v ref = 0.9 v / 0.75 v; c tt = 10 f (ceramic), t a = +25 c, unless otherwise specified. parameter test conditions symbol min typ max unit regulator output output offset voltage i out = 0 a v os ?16 ? +16 mv load regulation i out = 1.8 a, pv cc = 1.8 v, v ref = 0.9 v reg load ?4 ? +4 mv i out = 1.5 a, pv cc = 1.5 v, v ref = 0.75 v i out = 1.2 a, pv cc = 1.35 v, v ref = 0.675 v i out = 1.2 a, pv cc = 1.2 v, v ref = 0.6 v input and standby currents bias supply current i out = 0 a i bias ? 1 2.5 ma standby current v ref < 0.2 v (shutdown), r load = 180 i stb ? 2 90 a current limit protection current limit pv cc = 1.8 v, v ref = 0.9 v i lim 2 ? 3.5 a pv cc = 1.5 v, v ref = 0.75 v 1.5 ? 3.5 shutdown thresholds shutdown threshold voltage enable v ih 0.45 ? ? v shutdown v il ? ? 0.15 thermal shutdown thermal shutdown temperature v cc = 5 v t sd ? 125 ? c thermal shutdown hysteresis v cc = 5 v t sh ? 35 ? c product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions.
NCP51145 www. onsemi.com 5 package dimensions soic8?nb ep case 751bu issue e seating plane b notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b does not include dambar protrusion. allowable protrusion shall be 0.10mm in excess of maximum material condition. 4. dimension d does not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15mm per side. dimension e does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25mm per side. dimensions d and e are determined at datum f. 5. dimensions a and b are to be determined at datum f. 6. a1 is defined as the vertical distance from the seating plane to the lowest point on the package body. 7. tab contour may vary minimally to include tooling features. a dim min max millimeters g 1.55 2.39 a 1.35 1.75 b 0.31 0.51 e 1.27 bsc a1 0.00 0.10 b1 0.28 0.48 h 0.25 0.50 c m 0.25 dimension: millimeters *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* l2 0.25 bsc a top view c 0.20 a-b d c 0.10 note 5 c 0.10 b 8x b c 8x side view end view detail a 7.00 8x 1.52 8x 0.76 1.27 pitch recommended 1 l f seating plane detail a d l2 a1 c note 6 1 4 5 8 c 0.10 a-b note 5 e note 7 f g bottom view 2.60 2.60 c 0.17 0.25 l 0.40 1.27 2x note 4 2x 4 tips c 0.10 2x note 4 h c1 0.17 0.23 f 1.55 2.39 d 4.90 bsc e 6.00 bsc e1 3.90 bsc e e1 d d b ??? ??? ???
NCP51145 www. onsemi.com 6 package dimensions dfn8 2x2, 0.5p case 506aa issue f ?? ?? a d e b c 0.10 pin one 2x reference 2x top view side view bottom view a l (a3) d2 e2 c c 0.10 c 0.10 c 0.08 note 4 a1 seating plane e/2 e 8x k note 3 b 8x 0.10 c 0.05 c a b b dim min max millimeters a 0.80 1.00 a1 0.00 0.05 a3 0.20 ref b 0.20 0.30 d 2.00 bsc d2 1.10 1.30 e 2.00 bsc e2 0.70 0.90 e 0.50 bsc k l 0.25 0.35 1 4 8 5 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 2.30 0.50 0.50 8x dimensions: millimeters 0.30 pitch 8x 1 package outline recommended l1 detail a l optional constructions l detail b detail a l1 ??? 0.10 0.30 ref 0.90 1.30 ?? detail b mold cmpd exposed cu alternate constructions ?? on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 NCP51145/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative ?
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